Semiconductor

We offer a broad selection of used semiconductor manufacturing equipment for both front-end wafer processing and back-end assembly & testing. Whether you produce integrated circuits (ICs), MEMS, power devices, or photonic chips, our platform connects you with high-quality tools at competitive prices – available via auction or direct sale.

Our listings include equipment for all critical semiconductor processes, including deposition, lithography, etching, bonding, packaging, and inspection.

Typical front-end equipment:

• Wafer cleaning systems
• Photolithography steppers and aligners
• CVD, PVD and ALD deposition tools
• Etching systems (plasma, wet, dry)
• Oxidation and diffusion furnaces
• Ion implanters
• Wafer track systems and coaters/developers

Typical back-end equipment:

• Wafer dicing saws and scribers
• Die bonders and wire bonders
• Flip-chip and wafer-level packaging systems
• Encapsulation and molding machines
• Metrology and inspection systems (AOI, X-ray, SEM)
• Electrical test systems and probers

Well-known manufacturers frequently featured include:
ASML, Tokyo Electron (TEL), DISCO, SUSS MicroTec, EVG, KLA-Tencor, ASM, Applied Materials, Nikon, Canon, Kulicke & Soffa, Brooks, Teradyne, Credence

All equipment is professionally sourced from operational fabs, R&D facilities, and IDMs – often due to line upgrades, node migrations, or capacity consolidation. Listings include technical specifications, condition reports, and often inspection options.

Used semiconductor equipment offers a fast, flexible, and affordable path to expanding production without long procurement lead times.

Explore our current semiconductor equipment listings or contact us directly – we support customers worldwide in sourcing front-end and back-end semiconductor tools they can rely on.