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Online Auction | European PCB Producer Multilayer Prototype & Production Equipment
Listing 3:Wet Process & Plating
- Numerous Panel Accumulators by Mass-Laif-Wilbers
- (2) Schmid Scrubber & Deburr
- Schmid Alkaline Etcher w/intermittent spraying + Superflex
- Sauer Schmid Etcher w/Oxford System + Superflex
- Höllmüller/Rena Resist Developer with flexible transport
- Höllmüller LPI Developer with flexible transport
- Pill Pre-Clean Mec Etch Bond for paint + inner layers
- Höllmüller Anti-Tarnish for inner layers Mec
- Laif Shadow Line - Direct Metallization
- Laif Resist Stripper with cyclone
- Schmid Tin Stripper
- Laif Ni/Au manual electroplating w/post-cleaning + dryer
- Laif Ni/Au – chem. Sn - Osp manual electroplating w/post-cleaning + dryer
- Laif Cu & Tn Pattern Plate Electroplating Line
- PVA Tepla Plasma-Etch System
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