Description

RENESAS Die Attach System CM-700H; Year of Manufacture: 2007

Serial no.: P-3175114-01�" | Asset no.: "52656

Technical Details:

Model: CM 700H

Die bonders, 8" and 12"

Software Version 01.039/00

Productivity: UPH ; Max 3,300 [Process dependent]

Placement Accuracy: Ｘ,Ｙ ; <±38μm (3σ)

Material applicable:

Leadframe/substrate: Width : 25 to 95mm, Length : 130 to 260mm

Die: X, Y : 3×3 mm to 25×25 mm

Leadframe/substrate: Magazine to Magazine and Stack to Magazine

Bond Method: Face down, Heat compression.

Bond tool Temperature: up to 400℃

Bonding Speed BOC/LOC : 1.0s/die ; BGA/CSP : 1.9s/die (Depends on bonding condition)

Bond force: 7.8 to 147N (0.8 to 15 kgf)

Lamination Method: Gang compression with heat

Lamination tool temp.: up to 400℃

Lamination force: 19.6 to 490N (2 to 50 kgf)

Pre-bake oven: up to 300℃

Wafer Tape Expansion: 2 to 20mm; (Programmable) wafer tape dependent
Image Processing: Grey scale pattern matching 

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