Description

ALPHASEM Die Bonder SL9022; Year of Manufacture: 2003

Serial no.: SO20071" | Asset no.: "23766

Technical Details:

Alphasem model SL9022 HSL (high Speed lamination) is a fully automatic standalone die bonder that is capable of process LOC, BOC, BGA packages and has a Flip Chip concept which able the machine to run “face up” and “face Down” products. The operator loads Substracts / Leadframes materials at the Destacker loader and removes full magazines from the output. The Feed System automatically moves the Substracts / Leadframes from input to output being aligned at place position by zoom optical system. Wafers are loaded from a wafer cassette; the image processing system checks the dice to ensure correct alignment for bonding. The machine operations are computer controlled (Pentium III-850E-Mhz) and operative system NT 4.0 SP6.

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