Description

Description

The inline sputtering system of type GC140H is a complete inline system for the back contact coating of planar substrates under vacuum conditions.

Substrate dimensions

With this system, it is also possible to coat smaller individual substrates instead of a substrate of the maximum format

Dimensions (1,590 x 1,190) mm2
Substrate thickness 3 (2 ... 4) mm
Magnetron sputtering

The coating on one side is carried out using magnetron sputtering sources.

By means of magnetron sputtering (high-rate atomization) in a sputter-down arrangement, optical functional layer systems can be applied to one side of the substrates washed and dried before coating with the inline sputtering system GC140H.

Construction

The system is designed as a multi-chamber system and has a modular structure.

The shape of the vacuum chambers is function-related. They are connected vacuum-tight by special welded and screwed structures.

The inline sputtering system GC140H is divided into the following sections:

Lock chambers C1 and C7,
Buffer chamber C2,
Transfer chambers C3 and C5,
Process chamber C4 (4 sections each in C41 and C42)
The vacuum chambers are closed vacuum-tight with chamber lids. The chamber lids are equipped with different technologies, but have the same or similar media interfaces in order to ensure extensive interchangeability and compatibility.

The system has a high degree of automation and can therefore be controlled and monitored by an operator from a central operating station.

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Technical Details

Installation conditions

Dimensions of the installation space chambers (L x W x H) (17.4 x 5.5 x 3.3) m
Installation area with loading tables (L x W x H) (24.8 x 5.5 x 3.3) m
Installation area with units (L x W x H) (24.8 x 10 x 3.8) m
Mass of the entire system with aggregates, approx. 65 t
Area load max. 10 N / mm2
max.point load in the chamber area 5 t
Technological parameters of magnetrons

Number of RSM / RSM 1500 3L 5 pieces
Target mounting clamp
Target length 1,500 mm
Target cooling direct water cooling
Target thickness max.outer diameter (new target) 166 mm
Min.outer diameter (used target) 133 mm
Sprayed materials, approx. 4 mm
Target utilization depending on target shape 75%
Maximum current at the end blocks is 300 A at 30 kHz
Substrate

Dimensions (1,590 x 1,190) mm2
Substrate thickness 3 (2 ... 4) mm
Substrate transport
max.transfer speed, approx. 42 m / min
Speed ​​in the process range (0.1 ... 3.0) m / min
adjustable step width 0.01 m / min
nominal speed in the sputtering range 1.97 m / min
Substrate spacing in the process area 20 mm
Production
Cycle time 50 s
Good production> 98.8%
Machine performance parameters

Coating process
Sputtering Mo
DC magnetron sputtering in metallic mode,
rotating double cathode,
Target material Mo,
horizontal sputter-down arrangement
Gas separation
max. 1:10
Sputtering Mo
DC magnetron sputtering in metallic Mode,
rotating double cathode,
Wear material Mo,
horizontal sputter-down arrangement
cooling
Substrate temperature at the exit, max. 50 ° C
Coatings

Layers
Mo (base coat) 10 ± 1 nm
Mo (main coating) 350 ± 25 nm
Target lifetime
Mo (base coat) ³ 5,823 h
Mo (main coating) ³ 666 h
Vacuum

Final pressure in the sputtering chamber C4, open for 3 hours in ambient air, pump after 7 hours, device clean and dry 7.5 × 10-6 mbar
Evacuation of the sputtering area to a pressure level of
Transfer pressure of C2 / C3
Pressure deviation in a magnetron section after transferring the substrate
to / from buffer chamber C2 to / from transfer chamber C3 at a base pressure in C4 of £ 3.0 × 10-5 mbar and 50 s cycle time
Surface resistance measurement technology (SRM 50)

Contactless measurement method (eddy current) 1 measuring head
Measurement distance (10 ... 1,000) Ohm / m²
Measuring rate 10 s-1
absolute accuracy accuracy of the value ± 3%
Repeatability Repeatability of the value ± 1%